New PGA geometry

In the next dialogbox the parameters for a BGA (Ball Grid Array) geometry can be entered. The BGA geometry is a device based on through holes.

The following parameters can be changed:

Nr pins

If the total amount of pins is (Nr pins X * Nr pins Y). The pinnumber counting starts with A1 and increments with one for the following pins in the horizontal direction.In the vertical direction, counting is based on letter increments.For the first 23 rows the following letters will be used: A,B,C,D,E,F,G,H,J,K,L,M,N,P,R,S,T,U,V,W,X,Y,Z. Only the letters I,O,Q will not be used because of similarity with other characters. When more then 23 rows are necessary, two letters will be used. The 24th row will use the letters AA. The following rows will use the letters AB,AC,AD, … AZ,BA,BBBZ, etc.


Diameter anti power pad

The anti power pad will always be a circle.

If the anti power pad is not necessary, fill the parameter with zero.

Diameter inner pad

The inner pad will always be a circle.

If the inner pad is not necessary, fill the parameter with zero.



Pad solder mask

If the solder mask pad is not necessary, fill one of the parameters (X,Y) with zero.


The initial clearance is the clearance used for this geometry.

Starting pin nr

The starting pin nr is A1, and the pad can be a circle or a square.

The Use default rules for solder paste/mask, inner/anti power pad and clearance button can be used the fill in values based on the drill size.

image0 Through hole pin

image1 Design rules pad