New BGA geometry


In the next dialogbox the parameters for a BGA (Ball Grid Array) geometry can be entered. The BGA geometry is a SMD based device.

The following parameters can be changed:

Nr pins

If the total amount of pins is (Nr pins X * Nr pins Y). The pinnumber counting starts with A1 and increments with one for the following pins in the horizontal direction.In the vertical direction, counting is based on letter increments.For the first 23 rows the following letters will be used: A,B,C,D,E,F,G,H,J,K,L,M,N,P,R,S,T,U,V,W,X,Y,Z. Only the letters I,O,Q will not be used because of similarity with other characters. When more then 23 rows are necessary, two letters will be used. The 24th row will use the letters AA. The following rows will use the letters AB,AC,AD, … AZ,BA,BBBZ, etc.

Pad

Pitch

Pad solder mask

If the solder mask pad is not necessary, fill one of the parameters (X,Y) with zero.

Pad paste mask

If the paste mask pad is not necessary, fill one of the parameters (X,Y) with zero.

Clearance

The initial clearance is the clearance used for this geometry.

Starting pin nr

The starting pin nr is A1, and the pad can be a circle or a square.

The Use default rules for solder paste/mask and clearance button can be used the fill in values based on the pad size.

image0 SMD pad

image1 Design rules pad